V. Székely, M. Rencz, J. Karam, M. Lubaszewski, B. Courtois
{"title":"安全关键集成系统的热监测","authors":"V. Székely, M. Rencz, J. Karam, M. Lubaszewski, B. Courtois","doi":"10.1109/ATS.1996.555172","DOIUrl":null,"url":null,"abstract":"On-line temperature monitoring of safety-critical ICs and systems becomes more and more crucial because of downsizing of integrated circuits and of increased density due to advanced packaging. To prevent erroneous operation, temperature sensors should be placed on the critical spots, the outputs of which should be read by means of boundary scanned architectures or modified boundary scanned architectures in case of on-line monitoring.","PeriodicalId":215252,"journal":{"name":"Proceedings of the Fifth Asian Test Symposium (ATS'96)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Thermal monitoring of safety-critical integrated systems\",\"authors\":\"V. Székely, M. Rencz, J. Karam, M. Lubaszewski, B. Courtois\",\"doi\":\"10.1109/ATS.1996.555172\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"On-line temperature monitoring of safety-critical ICs and systems becomes more and more crucial because of downsizing of integrated circuits and of increased density due to advanced packaging. To prevent erroneous operation, temperature sensors should be placed on the critical spots, the outputs of which should be read by means of boundary scanned architectures or modified boundary scanned architectures in case of on-line monitoring.\",\"PeriodicalId\":215252,\"journal\":{\"name\":\"Proceedings of the Fifth Asian Test Symposium (ATS'96)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the Fifth Asian Test Symposium (ATS'96)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ATS.1996.555172\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Fifth Asian Test Symposium (ATS'96)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ATS.1996.555172","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal monitoring of safety-critical integrated systems
On-line temperature monitoring of safety-critical ICs and systems becomes more and more crucial because of downsizing of integrated circuits and of increased density due to advanced packaging. To prevent erroneous operation, temperature sensors should be placed on the critical spots, the outputs of which should be read by means of boundary scanned architectures or modified boundary scanned architectures in case of on-line monitoring.