电容、光学和电气互连的CMOS集成

2007 IEEE International Interconnect Technology Conferencee Pub Date : 2007-06-04 DOI:10.1109/IITC.2007.382354

J. Lexau, Xuezhe Zheng, J. Bergey, A. Krishnamoorthy, R. Ho, R. Drost, J. Cunningham

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引用次数: 13

摘要

我们提出了一种90纳米的测试芯片，集成了近距离通信，使用外部激光器和光电二极管的光学器件，以及单个CMOS芯片上的CML电子器件，可以通过其三个互连接口的任何组合以多gb /s的速率路由数据。一个强大的和灵活的解锁数据路径允许独立的定时和裕度表征每个路径。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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CMOS Integration of Capacitive, Optical, and Electrical Interconnects

We present a 90 nm test chip integrating proximity communication, optics using external lasers and photodiodes, and CML electronics on a single CMOS chip which can route data at multi-Gb/s rates through any combination of its three interconnect interfaces. A robust and flexible unclocked datapath allows independent timing and margin characterization of each path.

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2007 IEEE International Interconnect Technology Conferencee

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