2007 IEEE International Interconnect Technology Conferencee

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2007 IEEE International Interconnect Technology Conferencee - 最新文献

Highly-oriented PVD Ruthenium Liner for Low-resistance Direct-plated Cu Interconnects

Pub Date : 2007-06-04 DOI: 10.1109/IITC.2007.382331 M. Abe, M. Ueki, M. Tada, T. Onodera, N. Furutake, K. Shimura, S. Saito, Y. Hayashi

Chip Package Interaction for 65nm CMOS Technology with C4 Interconnections

Pub Date : 2007-06-04 DOI: 10.1109/IITC.2007.382388 M. Farooq, I. Melville, C. Muzzy, P. Mclaughlin, R. Hannon, W. Sauter, J. Muncy, D. Questad, C. Carey, M. Cullinan-Scholl, V. McGahay, M. Angyal, H. Nye, M. Lane, X. H. Liu, T. Shaw, C. Murray

Balancing Resistance and Capacitance of Signal Interconnects for Power Saving

Pub Date : 2007-06-04 DOI: 10.1109/IITC.2007.382372 V. Hoang, G. Doornbos, J. Michelon, A. Kumar, A. Nackaerts, P. Christie

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