C. Maleville, E. Neyret, N. B. Mohamed, C. Maunand-Tussot, D. Delprat
{"title":"Unibond/sup /spl工艺的纳米均匀性控制","authors":"C. Maleville, E. Neyret, N. B. Mohamed, C. Maunand-Tussot, D. Delprat","doi":"10.1109/SOI.2003.1242929","DOIUrl":null,"url":null,"abstract":"This paper deals with uniformity control in Unibond process, monitored from wafer scale down to device level scale, with a discussion of metrology solutions that are utilized.","PeriodicalId":329294,"journal":{"name":"2003 IEEE International Conference on SOI","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Nano-uniformity control in Unibond/sup /spl reg// process\",\"authors\":\"C. Maleville, E. Neyret, N. B. Mohamed, C. Maunand-Tussot, D. Delprat\",\"doi\":\"10.1109/SOI.2003.1242929\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper deals with uniformity control in Unibond process, monitored from wafer scale down to device level scale, with a discussion of metrology solutions that are utilized.\",\"PeriodicalId\":329294,\"journal\":{\"name\":\"2003 IEEE International Conference on SOI\",\"volume\":\"2015 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2003 IEEE International Conference on SOI\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOI.2003.1242929\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2003 IEEE International Conference on SOI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.2003.1242929","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Nano-uniformity control in Unibond/sup /spl reg// process
This paper deals with uniformity control in Unibond process, monitored from wafer scale down to device level scale, with a discussion of metrology solutions that are utilized.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
