用于IC封装和印刷电路板分析的高效鲁棒Dyadic Green函数评估算法

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI:10.1109/EPEPS.2016.7835453

Giacomo Bianconi, Jose' Pinto, Swagato Chakraborty

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引用次数: 6

摘要

本文提出了一种有效而准确的方法，用于在IC封装和印刷电路板等全三维电磁场景下对分层介质进行格林功能评估。

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Efficient and robust Dyadic Green's Function evaluation algorithm for the analysis of IC packages and printed circuit boards

This paper presents an efficient and accurate methodology for the layered media Green's function evaluation in fully 3D electromagnetic scenarios such as of IC packages and printed circuit boards.

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来源期刊

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)

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