{"title":"铜银线集成电路解封装新方法","authors":"Michael Obein, Francois Berger, P. Poirier","doi":"10.1109/EPTC.2015.7412398","DOIUrl":null,"url":null,"abstract":"Introduction of Cu and more recently of Ag wires in integrated circuits made the decapsulation more challenging for failure analysts. We made an experiment with the existing techniques we study in the past years and a comparison with the results and the emerging techniques from the last researchs. This study shows that solution has been demonstrated but there is still a place for improvement if we want to have a robust process for all types of ICs.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"New decapsulation methods for ICs with Cu and Ag wires\",\"authors\":\"Michael Obein, Francois Berger, P. Poirier\",\"doi\":\"10.1109/EPTC.2015.7412398\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Introduction of Cu and more recently of Ag wires in integrated circuits made the decapsulation more challenging for failure analysts. We made an experiment with the existing techniques we study in the past years and a comparison with the results and the emerging techniques from the last researchs. This study shows that solution has been demonstrated but there is still a place for improvement if we want to have a robust process for all types of ICs.\",\"PeriodicalId\":418705,\"journal\":{\"name\":\"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2015.7412398\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2015.7412398","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
New decapsulation methods for ICs with Cu and Ag wires
Introduction of Cu and more recently of Ag wires in integrated circuits made the decapsulation more challenging for failure analysts. We made an experiment with the existing techniques we study in the past years and a comparison with the results and the emerging techniques from the last researchs. This study shows that solution has been demonstrated but there is still a place for improvement if we want to have a robust process for all types of ICs.
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