Andrew C. Sabate, Norazfar Nordin, Benedict Jimenez
{"title":"熔断器接头物理分析方法","authors":"Andrew C. Sabate, Norazfar Nordin, Benedict Jimenez","doi":"10.1109/IPFA.2016.7564256","DOIUrl":null,"url":null,"abstract":"Fuse trim links failure on analog devices can cause wrong Vref value, incorrect I2C address, incorrect frequency setting, etc. The fuse trim links failure can either be unblown or mistakenly blown during the trimming process. To validate, if blown or unblown, physical analysis is needed to check the trim links. This paper aims to discuss the different physical analysis methodology to check the integrity of trim links.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Fuse trim links physical analysis methodology\",\"authors\":\"Andrew C. Sabate, Norazfar Nordin, Benedict Jimenez\",\"doi\":\"10.1109/IPFA.2016.7564256\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Fuse trim links failure on analog devices can cause wrong Vref value, incorrect I2C address, incorrect frequency setting, etc. The fuse trim links failure can either be unblown or mistakenly blown during the trimming process. To validate, if blown or unblown, physical analysis is needed to check the trim links. This paper aims to discuss the different physical analysis methodology to check the integrity of trim links.\",\"PeriodicalId\":206237,\"journal\":{\"name\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2016.7564256\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564256","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fuse trim links failure on analog devices can cause wrong Vref value, incorrect I2C address, incorrect frequency setting, etc. The fuse trim links failure can either be unblown or mistakenly blown during the trimming process. To validate, if blown or unblown, physical analysis is needed to check the trim links. This paper aims to discuss the different physical analysis methodology to check the integrity of trim links.