90nm和65nm CMOS工艺中基于scr的ESD保护器件的评价

J. di Sarro, K. Chatty, R. Gauthier, E. Rosenbaum
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引用次数: 43

摘要

作者比较了采用一致布局的90nm和65nm CMOS技术实现的一些有前途的基于scr的ESD保护器件。使用ESD指标对器件进行评估,如触发电压和电流、导通电阻、故障电流、导通时间和直流泄漏电流。作者还报道了可控硅导通时间高度依赖于施加脉冲的幅度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of SCR-Based ESD Protection Devices in 90nm and 65nm CMOS Technologies
The authors compare a number of promising SCR-based ESD protection devices in 90nm and 65nm CMOS technologies implemented with a consistent layout. The devices are evaluated using ESD metrics such as trigger voltage and current, on-resistance, failure current, turn-on time and DC leakage current. The authors also report that SCR turn-on time is highly dependent on the amplitude of the applied pulse.
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