创新架构时代的记忆

2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI:10.1109/VLSIT.2016.7573363

Dean Klein

{"title":"创新架构时代的记忆","authors":"Dean Klein","doi":"10.1109/VLSIT.2016.7573363","DOIUrl":null,"url":null,"abstract":"There is much buzz in the industry today about the “Post Moore's Law” state we are entering. Yet the opportunities for architectural innovation seem more prevalent than ever: 3D integration, advanced packaging solutions, specialized devices with specialized processes, new architectures and resiliency are just some areas of opportunity as we run out of an ability to scale in two dimensions.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Memory in the era of innovative architectures\",\"authors\":\"Dean Klein\",\"doi\":\"10.1109/VLSIT.2016.7573363\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"There is much buzz in the industry today about the “Post Moore's Law” state we are entering. Yet the opportunities for architectural innovation seem more prevalent than ever: 3D integration, advanced packaging solutions, specialized devices with specialized processes, new architectures and resiliency are just some areas of opportunity as we run out of an ability to scale in two dimensions.\",\"PeriodicalId\":129300,\"journal\":{\"name\":\"2016 IEEE Symposium on VLSI Technology\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-06-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Symposium on VLSI Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.2016.7573363\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2016.7573363","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

如今，业界对我们正在进入的“后摩尔定律”状态议论纷纷。然而，建筑创新的机会似乎比以往任何时候都更加普遍:3D集成，先进的封装解决方案，具有专门工艺的专用设备，新架构和弹性只是我们在二维扩展能力不足时的一些机会领域。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Memory in the era of innovative architectures

There is much buzz in the industry today about the “Post Moore's Law” state we are entering. Yet the opportunities for architectural innovation seem more prevalent than ever: 3D integration, advanced packaging solutions, specialized devices with specialized processes, new architectures and resiliency are just some areas of opportunity as we run out of an ability to scale in two dimensions.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2016 IEEE Symposium on VLSI Technology

自引率

0.00%

发文量