成型工艺采用高对准精度的LIGA技术

{"title":"成型工艺采用高对准精度的LIGA技术","authors":"A. Both, W. Bacher, M. Heckele, K. Muller, R. Ruprecht, M. Strohrmann","doi":"10.1109/MEMSYS.1995.472582","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Molding process with high alignment precision for the LIGA technology\",\"authors\":\"A. Both, W. Bacher, M. Heckele, K. Muller, R. Ruprecht, M. Strohrmann\",\"doi\":\"10.1109/MEMSYS.1995.472582\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":273283,\"journal\":{\"name\":\"Proceedings IEEE Micro Electro Mechanical Systems. 1995\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-01-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings IEEE Micro Electro Mechanical Systems. 1995\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.1995.472582\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.1995.472582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}