R1 - 14种无铅合金的可靠性比较研究

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Pub Date : 2013-12-01 DOI:10.1109/EPTC.2013.6745730

H. Wohlrabe, G. Reichelt

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引用次数: 5

摘要

焊点的可靠性是smt板质量的重要组成部分。本文提出了一个可靠性研究R1。研究的基础是使用14种不同的焊料合金(13种无铅焊料和一种Sn63合金作为参考)、6种不同的表面、6种不同的smd芯片以及3种不同的焊盘布局进行可靠性实验。采用高循环可靠性试验。用威布尔分析评估故障次数，然后进行方差分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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R1 — A reliability comparison study between 14 lead free alloys

The reliability of solder joints is one important part of the quality of SMT-Boards. The paper presents a reliability study named R1. The base of the study is a reliability experiment with 14 different solder alloys (13 lead free solders and a Sn63 alloy as a reference), six different surfaces, six different SMD-chips combined with three different pad layouts. A high cycle reliability test was used. The times of failures were evaluated with the Weibull analysis followed by an analysis of variance.

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2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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