T. Usami, C. Maruyama, M. Tagami, K. Watanabe, T. Kameshima, H. Masuda, M. Shimada, A. Gawase, Y. Kagawa, N. Nakamura, H. Miyajima, H. Naruse, Y. Enomoto, T. Kitano, M. Sekine
{"title":"45纳米节点器件用低k(多孔par /多孔sioc (k=2.3/2.3))混合多层Cu互连结构的粘附和提高粘附能的研究","authors":"T. Usami, C. Maruyama, M. Tagami, K. Watanabe, T. Kameshima, H. Masuda, M. Shimada, A. Gawase, Y. Kagawa, N. Nakamura, H. Miyajima, H. Naruse, Y. Enomoto, T. Kitano, M. Sekine","doi":"10.1109/IITC.2007.382358","DOIUrl":null,"url":null,"abstract":"Adhesion tests for a real Cu/low-k patterned structure were studied for 45-nm node devices. Results from 4 point-bending (4PB) and modified edge lift-off tests (m-ELT) were compared. Cu dual damascene interconnects structures with stacked hybrid low-k which is porous-poly-arylene(p-PAr)/porous-SiOC(p-SiOC) (k=2.3/2.3) were evaluated. Peel-off occurred in different locations in the real patterned structures subjected to the m-ELT test and in the structures subjected to the 4PB test. In addition, the adhesion energy (Gc: interface fracture energy) of the peeled-off interfaces was improved (Ge ges1.6x) by different treatment processes.","PeriodicalId":403602,"journal":{"name":"2007 IEEE International Interconnect Technology Conferencee","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A Study of Adhesion and Improvement of Adhesion Energy Using Hybrid Low-k (porous-PAr/ porous-SiOC(k=2.3/2.3)) Structures with Multi-layered Cu Interconnects for 45-nm Node Devices\",\"authors\":\"T. Usami, C. Maruyama, M. Tagami, K. Watanabe, T. Kameshima, H. Masuda, M. Shimada, A. Gawase, Y. Kagawa, N. Nakamura, H. Miyajima, H. Naruse, Y. Enomoto, T. Kitano, M. Sekine\",\"doi\":\"10.1109/IITC.2007.382358\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Adhesion tests for a real Cu/low-k patterned structure were studied for 45-nm node devices. Results from 4 point-bending (4PB) and modified edge lift-off tests (m-ELT) were compared. Cu dual damascene interconnects structures with stacked hybrid low-k which is porous-poly-arylene(p-PAr)/porous-SiOC(p-SiOC) (k=2.3/2.3) were evaluated. Peel-off occurred in different locations in the real patterned structures subjected to the m-ELT test and in the structures subjected to the 4PB test. In addition, the adhesion energy (Gc: interface fracture energy) of the peeled-off interfaces was improved (Ge ges1.6x) by different treatment processes.\",\"PeriodicalId\":403602,\"journal\":{\"name\":\"2007 IEEE International Interconnect Technology Conferencee\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-06-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE International Interconnect Technology Conferencee\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2007.382358\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Interconnect Technology Conferencee","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2007.382358","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Study of Adhesion and Improvement of Adhesion Energy Using Hybrid Low-k (porous-PAr/ porous-SiOC(k=2.3/2.3)) Structures with Multi-layered Cu Interconnects for 45-nm Node Devices
Adhesion tests for a real Cu/low-k patterned structure were studied for 45-nm node devices. Results from 4 point-bending (4PB) and modified edge lift-off tests (m-ELT) were compared. Cu dual damascene interconnects structures with stacked hybrid low-k which is porous-poly-arylene(p-PAr)/porous-SiOC(p-SiOC) (k=2.3/2.3) were evaluated. Peel-off occurred in different locations in the real patterned structures subjected to the m-ELT test and in the structures subjected to the 4PB test. In addition, the adhesion energy (Gc: interface fracture energy) of the peeled-off interfaces was improved (Ge ges1.6x) by different treatment processes.
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