用于集成电路诊断和故障分析的特征分析

Proceedings International Test Conference 1997 Pub Date : 1997-11-01 DOI:10.1109/TEST.1997.639632

C. Henderson, J. Soden

{"title":"用于集成电路诊断和故障分析的特征分析","authors":"C. Henderson, J. Soden","doi":"10.1109/TEST.1997.639632","DOIUrl":null,"url":null,"abstract":"A method of signature analysis is presented that is based on ATE data, experiential knowledge of failure modes and mechanisms, or a combination of both. This method can be used on low numbers of failures or even single failures. It uses the Dempster-Shafer theory to calculate failure mechanism confidence. This method can be used for rapid diagnosis of complex IC failures. The model is developed and an example is given based on Sandia's 0.5 /spl mu/m CMOS IC technology.","PeriodicalId":186340,"journal":{"name":"Proceedings International Test Conference 1997","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":"{\"title\":\"Signature analysis for IC diagnosis and failure analysis\",\"authors\":\"C. Henderson, J. Soden\",\"doi\":\"10.1109/TEST.1997.639632\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method of signature analysis is presented that is based on ATE data, experiential knowledge of failure modes and mechanisms, or a combination of both. This method can be used on low numbers of failures or even single failures. It uses the Dempster-Shafer theory to calculate failure mechanism confidence. This method can be used for rapid diagnosis of complex IC failures. The model is developed and an example is given based on Sandia's 0.5 /spl mu/m CMOS IC technology.\",\"PeriodicalId\":186340,\"journal\":{\"name\":\"Proceedings International Test Conference 1997\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"25\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Test Conference 1997\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1997.639632\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Test Conference 1997","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1997.639632","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 25

摘要

提出了一种基于ATE数据、失效模式和机制的经验知识或两者结合的特征分析方法。该方法可用于低故障数甚至单个故障。采用Dempster-Shafer理论计算失效机制置信度。该方法可用于复杂集成电路故障的快速诊断。基于Sandia公司的0.5 /spl mu/m CMOS集成电路技术，建立了该模型并给出了实例。

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Signature analysis for IC diagnosis and failure analysis

A method of signature analysis is presented that is based on ATE data, experiential knowledge of failure modes and mechanisms, or a combination of both. This method can be used on low numbers of failures or even single failures. It uses the Dempster-Shafer theory to calculate failure mechanism confidence. This method can be used for rapid diagnosis of complex IC failures. The model is developed and an example is given based on Sandia's 0.5 /spl mu/m CMOS IC technology.

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Proceedings International Test Conference 1997

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