采用双V/sub /晶体管的低漏SRAM设计

B. Amelifard, F. Fallah, Massoud Pedram
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引用次数: 28

摘要

本文提出了一种基于双阈值电压分配的方法,以降低sram的泄漏功耗,同时保持其性能。所提出的方法是基于观察到SRAM块中存储单元的读写延迟取决于该单元与感测放大器和解码器的物理距离。因此,关键思想是实现和部署不同类型的六晶体管SRAM单元,对应于单元中单个晶体管的不同阈值电压分配。与其他低泄漏SRAM设计技术不同,所提出的技术不会产生面积或延迟开销。此外,它只会导致SRAM设计流程的轻微变化。最后,提高了工艺变化下的静态噪声裕度。实验结果表明,该技术可使64Kb SRAM的漏功耗降低35%以上
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low-leakage SRAM design with dual V/sub t/ transistors
This paper presents a method based on dual threshold voltage assignment to reduce the leakage power dissipation of SRAMs while maintaining their performance. The proposed method is based on the observation that the read and write delays of a memory cell in an SRAM block depend on the physical distance of the cell from the sense amplifier and the decoder. The key idea is thus to realize and deploy different types of six-transistor SRAM cells corresponding to different threshold voltage assignments for individual transistors in the cell. Unlike other techniques for low-leakage SRAM design, the proposed technique incurs no area or delay overhead. In addition, it results only in a slight change in the SRAM design flow. Finally, it improves the static noise margin under process variations. Experimental results show that this technique can reduce the leakage-power dissipation of a 64Kb SRAM by more than 35%
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