用于高密度应用的新型纳米弹簧互连

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI:10.1109/ISAOM.2001.916604

Lunyu Ma, Qi Zhu, S. Sitaraman, C. Chua, D. Fork

{"title":"用于高密度应用的新型纳米弹簧互连","authors":"Lunyu Ma, Qi Zhu, S. Sitaraman, C. Chua, D. Fork","doi":"10.1109/ISAOM.2001.916604","DOIUrl":null,"url":null,"abstract":"A new cantilevered structure, called the nanospring, is being developed to enable a fine-pitch, high density I/O architecture for the next generation chip and probing technology. This technology meets the requirements of the National Technology Roadmap for Semiconductors (NTRS) for 2012 and beyond. Based on its unique structure, a new contact mode of sliding contact with no solder is being tested. To understand the reliability of the package with this novel compliant structure and the typical behavior of sliding contacts, test vehicles with different orientations of the nanospring (21 /spl mu/m pitch) have been fabricated, assembled and subjected to thermal cycling tests. In-situ resistance and temperature measurements have been conducted.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Novel nanospring interconnects for high-density applications\",\"authors\":\"Lunyu Ma, Qi Zhu, S. Sitaraman, C. Chua, D. Fork\",\"doi\":\"10.1109/ISAOM.2001.916604\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new cantilevered structure, called the nanospring, is being developed to enable a fine-pitch, high density I/O architecture for the next generation chip and probing technology. This technology meets the requirements of the National Technology Roadmap for Semiconductors (NTRS) for 2012 and beyond. Based on its unique structure, a new contact mode of sliding contact with no solder is being tested. To understand the reliability of the package with this novel compliant structure and the typical behavior of sliding contacts, test vehicles with different orientations of the nanospring (21 /spl mu/m pitch) have been fabricated, assembled and subjected to thermal cycling tests. In-situ resistance and temperature measurements have been conducted.\",\"PeriodicalId\":321904,\"journal\":{\"name\":\"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-03-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAOM.2001.916604\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAOM.2001.916604","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

一种名为纳米弹簧的新型悬臂结构正在开发中，它可以为下一代芯片和探测技术提供细间距、高密度的I/O架构。该技术符合2012年及以后的国家半导体技术路线图(NTRS)的要求。基于其独特的结构，正在测试一种新的无焊料滑动接触方式。为了了解具有这种新型柔性结构的封装的可靠性和滑动接触的典型行为，制造、组装了具有不同方向纳米弹簧(21 /spl mu/m节距)的测试车辆，并进行了热循环测试。进行了现场电阻和温度测量。

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Novel nanospring interconnects for high-density applications

A new cantilevered structure, called the nanospring, is being developed to enable a fine-pitch, high density I/O architecture for the next generation chip and probing technology. This technology meets the requirements of the National Technology Roadmap for Semiconductors (NTRS) for 2012 and beyond. Based on its unique structure, a new contact mode of sliding contact with no solder is being tested. To understand the reliability of the package with this novel compliant structure and the typical behavior of sliding contacts, test vehicles with different orientations of the nanospring (21 /spl mu/m pitch) have been fabricated, assembled and subjected to thermal cycling tests. In-situ resistance and temperature measurements have been conducted.

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

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