在模制封装上暴露模具背面的新样品制备技术

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2011-07-04 DOI:10.1109/IPFA.2011.5992743

R. Mendaros, Eugene Capito

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引用次数: 1

摘要

开发了两种新的样品制备方法，以获得模制封装中模具的背面。第一种方法是化学方法蚀刻掉模桨，另一种是机械方法，通过机械减薄后将桨剥落。一旦导电模贴暴露，用硝酸将其除去。

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Novel sample preparation techniques in exposing die backside on molded packages

Two novel sample preparation methods to access the backside of a die in a molded package have been developed. The first approach is a chemical method to etch away the die paddle, and the other is a mechanical approach through peeling off of the paddle after mechanical thinning. Once the conductive die-attach is exposed, it is removed using nitric acid.

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18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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