{"title":"可制造高密度PRAM的可靠性研究","authors":"K. Kim, S. Ahn","doi":"10.1109/RELPHY.2005.1493077","DOIUrl":null,"url":null,"abstract":"In this paper, PRAM (phase-change memory), exploiting new memory materials called chalcogenides, is introduced. The reliability issues for high-density commercial memory products such as disturbance immunity, endurance, and data retention are addressed and evaluated by using a 64 Mb PRAM with 0.12 /spl mu/m technology. Moreover, observed degradation modes and underlying physical mechanisms are investigated.","PeriodicalId":320150,"journal":{"name":"2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual.","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"127","resultStr":"{\"title\":\"Reliability investigations for manufacturable high density PRAM\",\"authors\":\"K. Kim, S. Ahn\",\"doi\":\"10.1109/RELPHY.2005.1493077\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, PRAM (phase-change memory), exploiting new memory materials called chalcogenides, is introduced. The reliability issues for high-density commercial memory products such as disturbance immunity, endurance, and data retention are addressed and evaluated by using a 64 Mb PRAM with 0.12 /spl mu/m technology. Moreover, observed degradation modes and underlying physical mechanisms are investigated.\",\"PeriodicalId\":320150,\"journal\":{\"name\":\"2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual.\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-04-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"127\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.2005.1493077\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.2005.1493077","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability investigations for manufacturable high density PRAM
In this paper, PRAM (phase-change memory), exploiting new memory materials called chalcogenides, is introduced. The reliability issues for high-density commercial memory products such as disturbance immunity, endurance, and data retention are addressed and evaluated by using a 64 Mb PRAM with 0.12 /spl mu/m technology. Moreover, observed degradation modes and underlying physical mechanisms are investigated.