Hui Wang, Jianwei Zhou, Taekoo Lee, Jun Wang, F. Xiao
{"title":"板级FBGA封装组合热循环&弯曲疲劳研究","authors":"Hui Wang, Jianwei Zhou, Taekoo Lee, Jun Wang, F. Xiao","doi":"10.1109/ICEPT.2005.1564672","DOIUrl":null,"url":null,"abstract":"A combined thermal cycling and bending fatigue test method is proposed for board level FBGA package. The fatigue lifetime of the board level FBGA package is studied with the combined acceleration method both with experimental and numerical analysis. The influence of initial pre-temperature cycling treatment on the bending fatigue life is studied. The failure analysis of failed samples was conducted, cracks were found in different sites of the package. The numerical analysis of the combined temperature cycle test and bending test was conducted. The simulation results of fatigue lifetime and failure site correspond to the experiment result well","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"150 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Board Level FBGA Package Combined Thermal Cycling & Bending Fatigue Study\",\"authors\":\"Hui Wang, Jianwei Zhou, Taekoo Lee, Jun Wang, F. Xiao\",\"doi\":\"10.1109/ICEPT.2005.1564672\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A combined thermal cycling and bending fatigue test method is proposed for board level FBGA package. The fatigue lifetime of the board level FBGA package is studied with the combined acceleration method both with experimental and numerical analysis. The influence of initial pre-temperature cycling treatment on the bending fatigue life is studied. The failure analysis of failed samples was conducted, cracks were found in different sites of the package. The numerical analysis of the combined temperature cycle test and bending test was conducted. The simulation results of fatigue lifetime and failure site correspond to the experiment result well\",\"PeriodicalId\":234537,\"journal\":{\"name\":\"2005 6th International Conference on Electronic Packaging Technology\",\"volume\":\"150 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-08-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 6th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2005.1564672\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564672","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A combined thermal cycling and bending fatigue test method is proposed for board level FBGA package. The fatigue lifetime of the board level FBGA package is studied with the combined acceleration method both with experimental and numerical analysis. The influence of initial pre-temperature cycling treatment on the bending fatigue life is studied. The failure analysis of failed samples was conducted, cracks were found in different sites of the package. The numerical analysis of the combined temperature cycle test and bending test was conducted. The simulation results of fatigue lifetime and failure site correspond to the experiment result well
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