{"title":"基于布图设计的互连结构优化系统(LADINOS)的互连结构设计新方法","authors":"S. Kobayashi, M. Edahiro, Y. Hayashi","doi":"10.1109/IITC.2000.854266","DOIUrl":null,"url":null,"abstract":"We present here the use of the performance predicting ECAD system, which is called Layout-design-based Interconnect Structure Optimization System (LADINOS), for the optimization of multilayer interconnect structures. This system is intended to be used to redesign current ULSI data on possible interconnect structures in the future and to measure the performance of such redesigned ULSIs. Despite the fact that system procedures include chip-size prediction, timing-driven assignment of interconnects to layers, and RC extraction which takes coupling capacitance into account, these procedures are performed very fast. We also give an example of the optimization of multi-layer interconnect structures for use in 0.13 /spl mu/m-generation ULSIs with Al-interconnects.","PeriodicalId":287825,"journal":{"name":"Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"New interconnect structure design methodology by Layout-design-based Interconnect Structure Optimization System (LADINOS)\",\"authors\":\"S. Kobayashi, M. Edahiro, Y. Hayashi\",\"doi\":\"10.1109/IITC.2000.854266\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present here the use of the performance predicting ECAD system, which is called Layout-design-based Interconnect Structure Optimization System (LADINOS), for the optimization of multilayer interconnect structures. This system is intended to be used to redesign current ULSI data on possible interconnect structures in the future and to measure the performance of such redesigned ULSIs. Despite the fact that system procedures include chip-size prediction, timing-driven assignment of interconnects to layers, and RC extraction which takes coupling capacitance into account, these procedures are performed very fast. We also give an example of the optimization of multi-layer interconnect structures for use in 0.13 /spl mu/m-generation ULSIs with Al-interconnects.\",\"PeriodicalId\":287825,\"journal\":{\"name\":\"Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2000.854266\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2000.854266","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
New interconnect structure design methodology by Layout-design-based Interconnect Structure Optimization System (LADINOS)
We present here the use of the performance predicting ECAD system, which is called Layout-design-based Interconnect Structure Optimization System (LADINOS), for the optimization of multilayer interconnect structures. This system is intended to be used to redesign current ULSI data on possible interconnect structures in the future and to measure the performance of such redesigned ULSIs. Despite the fact that system procedures include chip-size prediction, timing-driven assignment of interconnects to layers, and RC extraction which takes coupling capacitance into account, these procedures are performed very fast. We also give an example of the optimization of multi-layer interconnect structures for use in 0.13 /spl mu/m-generation ULSIs with Al-interconnects.