器件应用中优化散热的跨接口热传输

M. Kuball, J. Pomeroy
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引用次数: 0

摘要

材料和器件的异质集成为开发器件结构提供了巨大的机会,这些器件结构受益于电子和热材料性能的最佳组合。评估其界面上的热传递是至关重要的,以避免热瓶颈导致过高的器件温度。综述了评估材料导热性和材料间热边界阻的实验技术,并以GaN-on-Diamond、金刚石到金属金刚石复合材料为例进行了综述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications
Heterogenous integration of materials and devices opens huge opportunities for exploiting device structures which benefit from an optimal combination of electronic and thermal material properties. It is critically important to assess heat transfer across their interfaces to avoid thermal bottlenecks resulting in excessive device temperatures though. Experimental techniques to assess thermal conductivity of materials and thermal boundary resistance between materials are reviewed, with examples from GaN-on-Diamond, diamond to metal diamond composites.
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