MEMS杂交:弥合自由空间差距

P. Blair, D. McMillan, J. Podlecki, M. Begbie, K. Yallup
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引用次数: 1

摘要

对带宽日益增长的需求正在推动光纤电信行业新范式的发展,并导致一系列新光学元件的产生。采用的一种方法是将离散组件混合到单个封装中,以实现高功能子系统。MEMS与光导技术的结合是一种极具潜力的杂化途径。在新功能的驱动中,最重要的是性能参数不受损害,离散组件的混合也不应导致制造和封装复杂性和可靠性问题的增加。集成方案的理论和实验研究表明,仅使用简单的气隙就可以将MEMS元件与光导技术集成在一起,同时保留关键性能参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
MEMS hybridization: bridging the free-space gap
The increasing demand for bandwidth is driving the development of new paradigms within the fibre optic telecomms industry and leading to the generation of a new range of optical components. One route being taken is the hybridization of discrete components into a single package to realize high functionality subsystems. The combination of MEMS with light guide technology is one hybridization pathway that is showing considerable potential. In the drive for novel functionality it is paramount that the performance parameters are not compromised, nor should the hybridization of discrete components lead to increased manufacturing and packaging complexity and reliability issues. A theoretical and experimental study of integration schemes has shown that it is possible to integrate MEMS components with light guide technologies using just simple air gaps while preserving key performance parameters.
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