M. Jin, Changze Liu, Jinju Kim, Jungin Kim, S. Choo, Yoohwan Kim, H. Shim, Lijie Zhang, K. Nam, Jongwoo Park, S. Pae, Haebum Lee
{"title":"考虑FinFET技术自热的热载流子可靠性表征","authors":"M. Jin, Changze Liu, Jinju Kim, Jungin Kim, S. Choo, Yoohwan Kim, H. Shim, Lijie Zhang, K. Nam, Jongwoo Park, S. Pae, Haebum Lee","doi":"10.1109/IRPS.2016.7574505","DOIUrl":null,"url":null,"abstract":"A severity of hot carrier injection (HCI) in PFET becomes worse than NFET at elevated temperatures. This new observation is further found to be due to the coupled self-heating effects (SHE) during DC HCI stress (also a higher Ea in PFET HCI), rather than the negative bias temperature instability (NBTI) effect during HCI stress. Furthermore, in order to guarantee the precise estimation of HCI under circuit level AC condition, a new empirical HCI lifetime model decoupled from the SHE is proposed, which is further verified by the Si data from nanosecond pulsed waveform HCI stress and Ring Oscillator stress results.","PeriodicalId":172129,"journal":{"name":"2016 IEEE International Reliability Physics Symposium (IRPS)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"51","resultStr":"{\"title\":\"Hot carrier reliability characterization in consideration of self-heating in FinFET technology\",\"authors\":\"M. Jin, Changze Liu, Jinju Kim, Jungin Kim, S. Choo, Yoohwan Kim, H. Shim, Lijie Zhang, K. Nam, Jongwoo Park, S. Pae, Haebum Lee\",\"doi\":\"10.1109/IRPS.2016.7574505\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A severity of hot carrier injection (HCI) in PFET becomes worse than NFET at elevated temperatures. This new observation is further found to be due to the coupled self-heating effects (SHE) during DC HCI stress (also a higher Ea in PFET HCI), rather than the negative bias temperature instability (NBTI) effect during HCI stress. Furthermore, in order to guarantee the precise estimation of HCI under circuit level AC condition, a new empirical HCI lifetime model decoupled from the SHE is proposed, which is further verified by the Si data from nanosecond pulsed waveform HCI stress and Ring Oscillator stress results.\",\"PeriodicalId\":172129,\"journal\":{\"name\":\"2016 IEEE International Reliability Physics Symposium (IRPS)\",\"volume\":\"57 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-04-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"51\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Reliability Physics Symposium (IRPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.2016.7574505\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.2016.7574505","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Hot carrier reliability characterization in consideration of self-heating in FinFET technology
A severity of hot carrier injection (HCI) in PFET becomes worse than NFET at elevated temperatures. This new observation is further found to be due to the coupled self-heating effects (SHE) during DC HCI stress (also a higher Ea in PFET HCI), rather than the negative bias temperature instability (NBTI) effect during HCI stress. Furthermore, in order to guarantee the precise estimation of HCI under circuit level AC condition, a new empirical HCI lifetime model decoupled from the SHE is proposed, which is further verified by the Si data from nanosecond pulsed waveform HCI stress and Ring Oscillator stress results.