{"title":"具有内在灵敏度提升的三维可积纳米线场效应管传感器","authors":"C. O. Chui, J. Kina, K. Shin","doi":"10.1109/ICICDT.2011.5783190","DOIUrl":null,"url":null,"abstract":"In this paper, we review a recently developed transformative nanowire FET sensor concept and 3D-compatible fabrication technology. Compared to the generic nanowire FET sensors, an intrinsic boost in detection sensitivity is accomplished through the seamless integration of a sensing nanowire with an amplifying nanowire FET. Exclusively enabled by top-down nanofabrication technology, the back-end-of-line compatible sub-450 °C manufacturing processes have been developed. Sensing experimental data have also revealed around 1 order of magnitude sensitivity improvement in solution pH detection. Finally, an ultra-low thermal budget nanowire formation technology has been preliminarily developed for future 3D integration with CMOS.","PeriodicalId":402000,"journal":{"name":"2011 IEEE International Conference on IC Design & Technology","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"3D integrable nanowire FET sensor with intrinsic sensitivity boost\",\"authors\":\"C. O. Chui, J. Kina, K. Shin\",\"doi\":\"10.1109/ICICDT.2011.5783190\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we review a recently developed transformative nanowire FET sensor concept and 3D-compatible fabrication technology. Compared to the generic nanowire FET sensors, an intrinsic boost in detection sensitivity is accomplished through the seamless integration of a sensing nanowire with an amplifying nanowire FET. Exclusively enabled by top-down nanofabrication technology, the back-end-of-line compatible sub-450 °C manufacturing processes have been developed. Sensing experimental data have also revealed around 1 order of magnitude sensitivity improvement in solution pH detection. Finally, an ultra-low thermal budget nanowire formation technology has been preliminarily developed for future 3D integration with CMOS.\",\"PeriodicalId\":402000,\"journal\":{\"name\":\"2011 IEEE International Conference on IC Design & Technology\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE International Conference on IC Design & Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICICDT.2011.5783190\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Conference on IC Design & Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2011.5783190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D integrable nanowire FET sensor with intrinsic sensitivity boost
In this paper, we review a recently developed transformative nanowire FET sensor concept and 3D-compatible fabrication technology. Compared to the generic nanowire FET sensors, an intrinsic boost in detection sensitivity is accomplished through the seamless integration of a sensing nanowire with an amplifying nanowire FET. Exclusively enabled by top-down nanofabrication technology, the back-end-of-line compatible sub-450 °C manufacturing processes have been developed. Sensing experimental data have also revealed around 1 order of magnitude sensitivity improvement in solution pH detection. Finally, an ultra-low thermal budget nanowire formation technology has been preliminarily developed for future 3D integration with CMOS.