用微弯曲和振动法表征大块微加工钛膜的力学特性

G. Bécan, A. Bosseboeuf, J. Phung, H. Philippe, B. Boutaud, M. Woytasik, P. Coste, E. Lefeuvre
{"title":"用微弯曲和振动法表征大块微加工钛膜的力学特性","authors":"G. Bécan, A. Bosseboeuf, J. Phung, H. Philippe, B. Boutaud, M. Woytasik, P. Coste, E. Lefeuvre","doi":"10.1109/dtip54218.2021.9568677","DOIUrl":null,"url":null,"abstract":"This paper presents the mechanical characterization of membranes micromachined in bulk-titanium wafers, which can be future parts of various Ti-based MEMS such as pressure sensors or microvalves for corrosive environment. One membrane was characterized by microbending using a mechanical microprobe. Two membranes were characterized by vibrometry using microscopic interferometry, and the residual mechanical stress could be derived from these measurements. These are key experiments for successful design of future Ti-based MEMS.","PeriodicalId":173313,"journal":{"name":"2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-08-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mechanical characterization of bulk-micromachined Ti membranes by microbending and by vibrometry\",\"authors\":\"G. Bécan, A. Bosseboeuf, J. Phung, H. Philippe, B. Boutaud, M. Woytasik, P. Coste, E. Lefeuvre\",\"doi\":\"10.1109/dtip54218.2021.9568677\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the mechanical characterization of membranes micromachined in bulk-titanium wafers, which can be future parts of various Ti-based MEMS such as pressure sensors or microvalves for corrosive environment. One membrane was characterized by microbending using a mechanical microprobe. Two membranes were characterized by vibrometry using microscopic interferometry, and the residual mechanical stress could be derived from these measurements. These are key experiments for successful design of future Ti-based MEMS.\",\"PeriodicalId\":173313,\"journal\":{\"name\":\"2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-08-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/dtip54218.2021.9568677\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/dtip54218.2021.9568677","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文介绍了在大块钛晶圆中微机械加工膜的力学特性,这可以成为未来各种基于钛的MEMS的部件,如压力传感器或腐蚀环境的微阀。用机械探针对其中一种膜进行了微弯曲表征。用显微干涉振动法对两种膜进行了表征,并从这些测量结果中得出了残余机械应力。这些实验是未来ti基MEMS成功设计的关键。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mechanical characterization of bulk-micromachined Ti membranes by microbending and by vibrometry
This paper presents the mechanical characterization of membranes micromachined in bulk-titanium wafers, which can be future parts of various Ti-based MEMS such as pressure sensors or microvalves for corrosive environment. One membrane was characterized by microbending using a mechanical microprobe. Two membranes were characterized by vibrometry using microscopic interferometry, and the residual mechanical stress could be derived from these measurements. These are key experiments for successful design of future Ti-based MEMS.
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