冲击试验下焊点断裂的瞬态模拟

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396696

Chang-Lin Yen, Y. Lai

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引用次数: 21

摘要

本文对冲击载荷作用下焊点的瞬态变形和断裂进行了数值研究。三维有限元分析采用显式时间积分方案，结合接触、断裂和破碎机制，预测了冲击载荷作用下焊点的瞬态响应和破坏模式。

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Transient simulation of solder joint fracturing under impact test

In this paper, transient deformation and fracturing of solder joints subjected to the impact load are investigated numerically. The three-dimensional finite element analysis applies the explicit time integration scheme and incorporates as well contact, fracturing and fragmentation mechanisms to predict the transient response and the failure mode of the solder joint subjected to an impact load.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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