可植入电子设备的新型小型化封装

2012 IEEE International Interconnect Technology Conference Pub Date : 2012-06-04 DOI:10.1109/IITC.2012.6251669

K. Qian, M. O. de Beeck, G. Bryce, K. Malachowski, C. van Hoof

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引用次数: 4

摘要

介绍了一种新型的可植入电子系统的生物相容性封装工艺，该工艺将优异的生物相容性和密封性与极端小型化相结合。评估和选择生物相容和洁净室相容的材料和集成工艺，用于芯片封装和互连。使用去离子水和更具侵略性的生物流体进行的细胞毒性、扩散试验和腐蚀试验表明，该包装具有良好的性能。

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Novel miniaturized packaging for implantable electronic devices

A novel biocompatible packaging process for implantable electronic systems is described, combining excellent biocompatibility and hermeticity with extreme miniaturization. Biocompatible and clean room compatible materials and integration processes are evaluated and selected for die encapsulation and interconnection. Cytotoxicity, diffusion tests and corrosion tests using DI water and more aggressive bio-fluids demonstrated promising performance of the packaging.

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来源期刊

2012 IEEE International Interconnect Technology Conference

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