反体偏置辐射——难以设计逻辑门

L. Clark, K.C. Mohr, K. Holbert
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引用次数: 9

摘要

提出了不同的辐射硬化设计技术,以减轻NMOS晶体管的总电离剂量效应。将NMOS环形布局晶体管与双面晶体管进行比较,并对CMOS栅极面积、延迟、有源和泄漏功率以及TID硬度进行反体偏置(RBB)硬化。在130 nm块体CMOS工艺上使用Co-60辐照测试结构的加速测试表明,RBB提供了更小的器件,并且在1 Mrad(Si)时允许更少的芯片级泄漏,比使用环形栅极进行预辐照的设计硬化。四扇通(FO4)双输入NAND门的仿真表明,RBB提供了与传统双边门相当的能量延迟积(EDP)。不同的环形拓扑结构的EDP要高出35%到350%以上
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reverse-Body Biasing for Radiation-Hard by Design Logic Gates
Different radiation hardening by design techniques for mitigating total ionizing dose (TID) effects in NMOS transistors are presented. NMOS annular layout transistors are compared to two-edge and hardened by reverse-body bias (RBB) with respect to CMOS gate area, delay, active and leakage power, and TID hardness. Accelerated testing using Co-60 irradiation of test structures on a 130 nm bulk CMOS process shows that RBB provides smaller devices and allows less chip-level leakage at 1 Mrad(Si) than a design hardened using annular gates has pre-irradiation. Simulations of fanout-of-four (FO4) two-input NAND gates show that RBB provides an energy-delay product (EDP) comparable to conventional two-edge gates. Different annular topologies have EDP 35% to over 350% greater
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