HOY测试员- IC测试可以无线化吗?

Cheng-Wen Wu, Chih-Tsun Huang, Shi-Yu Huang, Po-Chiun Huang, Tsin-Yuan Chang, Yu-Tsao Hsing
{"title":"HOY测试员- IC测试可以无线化吗?","authors":"Cheng-Wen Wu, Chih-Tsun Huang, Shi-Yu Huang, Po-Chiun Huang, Tsin-Yuan Chang, Yu-Tsao Hsing","doi":"10.1109/VDAT.2006.258155","DOIUrl":null,"url":null,"abstract":"Test cost is becoming a more and more significant portion of the cost structure in advanced semiconductor products. To address this issue, we propose HOY - a novel wireless test system with enhanced embedded test features. We present the concept, architecture, and test flow for future semiconductor products tested by HOY. Necessary technologies for the success of HOY also are presented, though most of which require further investigation. A preliminary demonstration system has been constructed, and experiments are being conducted","PeriodicalId":356198,"journal":{"name":"2006 International Symposium on VLSI Design, Automation and Test","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":"{\"title\":\"The HOY Tester-Can IC Testing Go Wireless?\",\"authors\":\"Cheng-Wen Wu, Chih-Tsun Huang, Shi-Yu Huang, Po-Chiun Huang, Tsin-Yuan Chang, Yu-Tsao Hsing\",\"doi\":\"10.1109/VDAT.2006.258155\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Test cost is becoming a more and more significant portion of the cost structure in advanced semiconductor products. To address this issue, we propose HOY - a novel wireless test system with enhanced embedded test features. We present the concept, architecture, and test flow for future semiconductor products tested by HOY. Necessary technologies for the success of HOY also are presented, though most of which require further investigation. A preliminary demonstration system has been constructed, and experiments are being conducted\",\"PeriodicalId\":356198,\"journal\":{\"name\":\"2006 International Symposium on VLSI Design, Automation and Test\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"25\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 International Symposium on VLSI Design, Automation and Test\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VDAT.2006.258155\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 International Symposium on VLSI Design, Automation and Test","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VDAT.2006.258155","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 25

摘要

测试成本在先进半导体产品的成本结构中所占的比重越来越大。为了解决这个问题,我们提出了HOY -一种新型的无线测试系统,具有增强的嵌入式测试功能。我们介绍了HOY测试的未来半导体产品的概念、架构和测试流程。此外,本文还提出了成功实施HOY的必要技术,但其中大部分技术仍需进一步研究。初步构建了示范系统,正在进行实验
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The HOY Tester-Can IC Testing Go Wireless?
Test cost is becoming a more and more significant portion of the cost structure in advanced semiconductor products. To address this issue, we propose HOY - a novel wireless test system with enhanced embedded test features. We present the concept, architecture, and test flow for future semiconductor products tested by HOY. Necessary technologies for the success of HOY also are presented, though most of which require further investigation. A preliminary demonstration system has been constructed, and experiments are being conducted
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