CMOS SOI晶体管在电路运行中的动态老化

E. Guichard, G. Reimbold, S. Cristoloveanu, C. Leroux, D. Blachier, G. Borel, B. Giffard
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引用次数: 4

摘要

SOI晶体管,在动态模式下工作,已经充分研究了使用专用测试电路。事实上,为了对n-和p- mosfet的电特性进行现场监测,已经建立了特定的电路。我们已经证明,在部分耗尽的SOI器件中,在静态和动态应力后,降解的物理机制是可比的。事实上,反向界面退化分析表明,即使在动态老化之后,p- mosfet也会被电子捕获,而n- mosfet则不会。“准静态”方法不适用于逆变器型电路,可以解释为由于特定偏置波形而连续注入空穴和电子,导致退化增强。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dynamic aging of CMOS SOI transistors in circuit operation
SOI transistors, operating in dynamic mode, have been fully investigated using dedicated test circuits. Indeed, specific circuits have been built in order to make, in-situ monitoring of electrical characteristics of n- and p-MOSFETs. We have demonstrated that physical mechanisms of the degradation, in partially depleted SOI devices, are comparable after static and dynamic stress. Indeed, back interface degradation analysis has revealed that, even after dynamic aging, p-MOSFETs are submitted to electron trapping while it is not the case for n-MOSFETs. The "quasi static" approach is not applicable in inverter-type circuit, and could be explained by successive injection of holes and electrons due to the specific bias waveform, leading to an enhancement of the degradation.
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