提高单聚双极晶体管热载流子可靠性的简单技术

S. Kosier, M. DeLaus, A. Wei, peixiong zhao, A. Martinez
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引用次数: 4

摘要

实验和仿真结果表明,减小氧化屏厚度可以提高发射基结击穿电压(BV/sub ebo/),降低击穿时的峰值电场,从而提高热载子可靠性。减少的丝网氧化物厚度对峰值截止频率的影响是最小的。对于这些器件,将屏幕氧化物从55 nm减薄到35 nm可使BV/sub - ebo/增加0.2 V,在基极-发射极电压为0.6 V时,将热载子诱导的过量基极电流提高一个数量级以上,并将峰值截止频率仅降低3%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simple technique for improving the hot-carrier reliability of single-poly bipolar transistors
It is shown experimentally and through simulation that reduced screen oxide thickness leads to increased breakdown voltage of the emitter-base junction (BV/sub ebo/) and reduced peak electric field at breakdown, which translates into improved hot-carrier reliability. The effect of reduced screen oxide thickness on the peak cutoff frequency is minimal. For these devices, thinning the screen oxide from 55 to 35 nm increases BV/sub ebo/ by 0.2 V, improves the hot-carrier-induced excess base current by more than an order of magnitude at a base-emitter voltage of 0.6 V, and degrades the peak cutoff frequency by only 3 percent.
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