{"title":"面向asic半导体工艺开发的通用测试芯片格式","authors":"C. Weber","doi":"10.1109/ICMTS.1993.292911","DOIUrl":null,"url":null,"abstract":"A novel approach towards test chip and test structure design is accelerating the introduction of application specific integrated circuit (ASIC)-oriented CMOS process generations. Specialized test chips address quality manufacturability and process integration issues within the proper time frame. Six generic test chip design formats repeat from generation to generation with scaled layout rules.<<ETX>>","PeriodicalId":123048,"journal":{"name":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Generic test chip formats for ASIC-oriented semiconductor process development\",\"authors\":\"C. Weber\",\"doi\":\"10.1109/ICMTS.1993.292911\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel approach towards test chip and test structure design is accelerating the introduction of application specific integrated circuit (ASIC)-oriented CMOS process generations. Specialized test chips address quality manufacturability and process integration issues within the proper time frame. Six generic test chip design formats repeat from generation to generation with scaled layout rules.<<ETX>>\",\"PeriodicalId\":123048,\"journal\":{\"name\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1993.292911\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1993.292911","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Generic test chip formats for ASIC-oriented semiconductor process development
A novel approach towards test chip and test structure design is accelerating the introduction of application specific integrated circuit (ASIC)-oriented CMOS process generations. Specialized test chips address quality manufacturability and process integration issues within the proper time frame. Six generic test chip design formats repeat from generation to generation with scaled layout rules.<>