7 Years after the A10 Processor, the Era of Heterogeneous Integration

After the appearance of Apple’s A10 processor in 2015, advanced packaging technology based on the 12 inch wafer process has created a new market. Various new advanced packaging technologies have been developed, and many heterogeneous integration products have been appeared, becoming mainstream of the development of semiconductor technology. SK hynix has developed its own technology and is ahead of the market as an advanced packaging product that applies TSV(Through Silicon Via) such as HBM(High Bandwidth Memory). This paper introduced wafer molding, chip to wafer stacking, and processes that apply machine learning, which are unique mass production technologies of SK hynix.