程控NiSi保险丝的相变:扩散、团聚和热稳定性

Jongwoo Park, Hanbyul Kang, G. Kim, Min Kim
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引用次数: 1

摘要

一种先进的CMOS工艺可靠性鉴定,特别是NiSi多门控保险丝(eFuse),包括电气特性、物理分析和可靠性评估。本文对高温储存(HTS)实验诱导的程序化NiSi多门控熔体的微观结构行为进行了研究。原位透射电镜(TEM)和前透射电镜(ex- TEM)结果表明,在250°C高温高温下,Ni3Si2的低温生长导致了程序eFuse后电阻的提高。此外,结合eFuse的可靠性,全面研究了Ni团聚现象,即在熔断器上有无孔洞的程序熔断器上Ni3Si2形成的倾向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Phase transformation of programmed NiSi electrical fuse: Diffusion, agglomeration and thermal stability
An advanced CMOS technology process reliability qualification especially for the NiSi poly gated electrical fuse (eFuse) consists of electrical characterization, physical analyses and reliability evaluations. In this paper, insights are given on microstructural behaviors of the programmed NiSi poly gated eFuse induced by the high temperature storage (HTS) test. Both ex- and in-situ transmission electron microscopy (TEM) reveal that the improved post-resistance of the programmed eFuse is attributed to the low temperature growth of Ni3Si2 during HTS test at 250°C. In addition, the Ni agglomeration, the propensity of Ni3Si2 formation on the programmed eFuse with and without void appearance on the fuse link, is comprehensively investigated in conjunction with the eFuse reliability.
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