用于DC-DC/AC-DC变换器的三维TSV变压器设计

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI:10.1109/ECTC.2010.5490761

Bolun Zhang, Y. Xiong, Lei Wang, Sanming Hu, Jinglin Shi, Yi-qi Zhuang, Le-Wei Li, X. Yuan

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引用次数: 16

摘要

提出了一种利用硅通孔(TSV)技术实现三维变压器结构的新概念。设计并分析了一套不同匝比的变压器。结果表明，所设计的三维TSV变压器具有体积小、性能好等优点。最后，设计了基于该变压器的交直流变换器电路。结果表明，所提出的三维TSV变压器适用于交直流变换器的设计。

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3D TSV transformer design for DC-DC/AC-DC converter

This paper presents a new concept of 3D transformer structure realized by through silicon via (TSV) technology. A set of different turn ratio transformers have been designed and analyzed. The results show that the proposed 3D TSV transformer possesses good performance with small size. Finally, an AC to DC converter circuit which based on proposed transformer has been designed. The result demonstrates that proposed 3D TSV transformer is suitable for AC to DC converter design.

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来源期刊

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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