采用模拟退火方法自动提取SiO/sub //高k栅极MOS器件和材料参数

Fei Li, S. Mudanai, Yang-yu Fan, Wei Zhao, L. Register, S. Banerjee
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引用次数: 3

摘要

介绍了一种能够在几分钟内高精度地从实验栅电容(C-V)和栅漏电流(I-V)中提取纳米级有效氧化物厚度(EOTs) SiO/sub 2/高k栅极介质MOS电容器器件和材料参数的程序。采用模拟退火算法作为优化方法。器件参数如eot、表面衬底掺杂、平带电压和多晶硅掺杂(如果适用)可以从C-V数据中提取,并且可以从单个或多层栅极堆栈的I-V数据中提取潜在的频带偏移、介电常数和隧道质量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A simulated annealing approach for automatic extraction of device and material parameters of MOS with SiO/sub 2//high-K gate stacks
A program with ability to extract device and material parameters of MOS capacitors with nanometer scale effective oxide thicknesses (EOTs) SiO/sub 2//high-K gate dielectrics from experimental gate capacitance (C-V) and gate leakage current (I-V) with high accuracy in a few minutes is demonstrated. Simulated annealing algorithm was used as the optimisation approach. The device parameters such as EOTs, surface substrate doping, flatband voltage and polysilicon doping (if applicable) can be extracted from C-V data, and potentially band offsets, dielectric constants and tunneling masses can be extracted from I-V data of single or multiplayer gate stacks.
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