硅基硬玻璃层技术及其在微波半导体器件中的应用

ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172) Pub Date : 1998-10-05 DOI:10.1109/ASDAM.1998.730177

M. Grabowski, W. Jabłoński

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引用次数: 1

摘要

本文介绍了在硅衬底上制备硬玻璃层的方法。晶圆片的厚度从几微米到一百微米不等。硬玻璃层应用于微波半导体元件作为钝化层或厚介电支撑束引线触点，以减少寄生电容。

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The technology of hard glass layers on silicon substrates and their application in microwave semiconductor devices

Paper describes the method of preparing of hard glass layers on silicon substrates. The thickness of the wafers run from few to one hundred micrometers. Hard glass layers are applied for microwave semiconductor components as passivation layers or thick dielectric supports for beam-leads contacts to reduce parasitic capacitance.

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ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172)

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