{"title":"表面通道电荷耦合器件的动态信号模型","authors":"S. Bri, L. Zenkouar, M. Yebari","doi":"10.1109/ICM.2001.997508","DOIUrl":null,"url":null,"abstract":"The CCDs are used widely in special applications for very large scale integration (VLSI). In this paper, we have studied transfer charges coupled devices (CCDs) between adjacent MOS capacities under the control of an externally applied voltage. In order to show the role of the potential space inter-electrodes, a numerical program was developed and adapted to different CCD technologies.","PeriodicalId":360389,"journal":{"name":"ICM 2001 Proceedings. The 13th International Conference on Microelectronics.","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Dynamic signal model in the surface channel charge coupled devices\",\"authors\":\"S. Bri, L. Zenkouar, M. Yebari\",\"doi\":\"10.1109/ICM.2001.997508\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The CCDs are used widely in special applications for very large scale integration (VLSI). In this paper, we have studied transfer charges coupled devices (CCDs) between adjacent MOS capacities under the control of an externally applied voltage. In order to show the role of the potential space inter-electrodes, a numerical program was developed and adapted to different CCD technologies.\",\"PeriodicalId\":360389,\"journal\":{\"name\":\"ICM 2001 Proceedings. The 13th International Conference on Microelectronics.\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICM 2001 Proceedings. The 13th International Conference on Microelectronics.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICM.2001.997508\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICM 2001 Proceedings. The 13th International Conference on Microelectronics.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICM.2001.997508","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Dynamic signal model in the surface channel charge coupled devices
The CCDs are used widely in special applications for very large scale integration (VLSI). In this paper, we have studied transfer charges coupled devices (CCDs) between adjacent MOS capacities under the control of an externally applied voltage. In order to show the role of the potential space inter-electrodes, a numerical program was developed and adapted to different CCD technologies.