Selective Transfer of Si Thin-Film Microchips for Fluidic Self-Assembly

Fluid self-assembly is one of the promising methods for bonding and integrating micron-order optoelectronic devices on semiconductor chips. In this study, we investigated the fluid self-assembly process using an unprecedented Si thin film and quantitatively evaluated the selectivity in integration by introducing a thermal oxide film. In the thin film separation process, good separation performance from the substrate was achieved by performing SiO2 layer etching while applying ultrasonic vibration, and the selectivity in integration could be improved by introducing a thermal oxide film to the receiver substrate.