{"title":"激光回流焊中无铅焊料球与Au/Ni/Cu焊盘的界面反应","authors":"Yarong Chen, Yanhong Tian, Chunqing Wang","doi":"10.1109/ICEPT.2005.1564748","DOIUrl":null,"url":null,"abstract":"The interfacial reaction between Sn-Ag-Cu and Sn-Ag lead-free solder balls and Au/Ni/Cu pads in laser reflow process are presented in this paper. A continuous intermetallic compound layer and some needle-like AuSn4 were observed at the interface of solder and pad, their morphology and distribution were strongly dependent on the laser input energy. Some voids were observed at the interface of solder joints when using laser as the heating source and they weakened the joints. The formation of voids maybe caused by the unique properties of laser","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering\",\"authors\":\"Yarong Chen, Yanhong Tian, Chunqing Wang\",\"doi\":\"10.1109/ICEPT.2005.1564748\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The interfacial reaction between Sn-Ag-Cu and Sn-Ag lead-free solder balls and Au/Ni/Cu pads in laser reflow process are presented in this paper. A continuous intermetallic compound layer and some needle-like AuSn4 were observed at the interface of solder and pad, their morphology and distribution were strongly dependent on the laser input energy. Some voids were observed at the interface of solder joints when using laser as the heating source and they weakened the joints. The formation of voids maybe caused by the unique properties of laser\",\"PeriodicalId\":234537,\"journal\":{\"name\":\"2005 6th International Conference on Electronic Packaging Technology\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-08-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 6th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2005.1564748\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564748","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering
The interfacial reaction between Sn-Ag-Cu and Sn-Ag lead-free solder balls and Au/Ni/Cu pads in laser reflow process are presented in this paper. A continuous intermetallic compound layer and some needle-like AuSn4 were observed at the interface of solder and pad, their morphology and distribution were strongly dependent on the laser input energy. Some voids were observed at the interface of solder joints when using laser as the heating source and they weakened the joints. The formation of voids maybe caused by the unique properties of laser
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