阈值电压偏差对90nm SRAM核心-电池行为的影响

M. Bastian, Vincent Gouin, P. Girard, C. Landrault, A. Ney, S. Pravossoudovitch, A. Virazel
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摘要

目前,纳米级固态存储器越来越容易出现器件参数偏差。在本文中,我们考虑阈值电压(Vt)偏差的6T核心电池设计与90纳米技术。静态错误(转换和读破坏)和动态错误(动态读破坏)作为错误行为得到。此外,电气数据显示,PVT(过程、电压、温度)拐角能够最大限度地检测出这些故障,这是非常非常规的。特别是,我们发现Vt偏差在低电压下产生主要影响,而硬缺陷,如芯胞中的电阻性开放缺陷,在高电压下更好地表现出来。这项参数偏差的研究为纳米级sram的测试带来了一个额外的问题,这个问题在更深层次的技术(65纳米和45纳米)中会更加严重。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of Threshold Voltage Deviations on 90nm SRAM Core-Cell Behavior
Nanoscaled SRAMs are now becoming more and more prone to device parameter deviations. In this paper, we consider threshold voltage (Vt) deviations in 6T core-cells designed with 90 nm technology. Static faults (transition and read destructive) but also dynamic faults (dynamic read destructive) are obtained as resulting faulty behaviors. Moreover, electrical data show that PVT (process, voltage, temperature) corners that maximize the detection of these faults are quite unconventional. Especially, we show that Vt deviations have their main impact at low voltage while hard defects, such as resistive-open defects in the core-cell, better manifest themselves at high voltage. This study of parameter deviations opens an additional problematic for the test of nanoscaled SRAMS that will be much more severe in deeper technologies (65 nm and 45 nm).
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