Ar+H2常压等离子体处理Au-Au键合及空气暴露对表面污染的影响

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-06-13 DOI:10.23919/LTB-3D.2017.7947460

Michitaka Yamamoto, E. Higurashi, T. Suga, R. Sawada, T. Itoh

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引用次数: 1

摘要

采用氩气和氢气混合物(Ar+H2)常压(AP)等离子体处理表面活化键合，证明了Au-Au在室温环境空气中的键合。虽然常规的氩低压等离子体处理仅在空气暴露1小时内提高了结合强度，但氩+H2 AP等离子体处理即使在空气暴露10小时后也能提高结合强度。

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Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination

Au-Au room-temperature bonding in ambient air was demonstrated by applying argon and hydrogen gas mixture (Ar+H2) atmospheric-pressure (AP) plasma treatment to surface activated bonding. Although conventional Ar low-pressure plasma treatment improved bonding strength only within air exposure for 1 hour, Ar+H2 AP plasma treatment improved the bonding strength even after air exposure for 10 hours.

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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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