楼层规划中的产量和路线目标

I. Koren, Z. Koren
{"title":"楼层规划中的产量和路线目标","authors":"I. Koren, Z. Koren","doi":"10.1109/DFTVS.1998.732148","DOIUrl":null,"url":null,"abstract":"Traditionally the floorplan of a chip has been determined so as to minimize the total chip area and reduce the routing costs. Recently, it has been shown that the floorplan also affects the yield of the chip. Consequently, it becomes desirable to consider the expected yield, in addition to the cost of routing, when selecting a floorplan. The goal of this paper is to study the two seemingly disjoint objectives of yield enhancement and routing complexity minimization, and find out whether they lead to different optimal floorplans, resulting in a need for a tradeoff analysis.","PeriodicalId":245879,"journal":{"name":"Proceedings 1998 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (Cat. No.98EX223)","volume":"349 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Yield and routing objectives in floorplanning\",\"authors\":\"I. Koren, Z. Koren\",\"doi\":\"10.1109/DFTVS.1998.732148\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Traditionally the floorplan of a chip has been determined so as to minimize the total chip area and reduce the routing costs. Recently, it has been shown that the floorplan also affects the yield of the chip. Consequently, it becomes desirable to consider the expected yield, in addition to the cost of routing, when selecting a floorplan. The goal of this paper is to study the two seemingly disjoint objectives of yield enhancement and routing complexity minimization, and find out whether they lead to different optimal floorplans, resulting in a need for a tradeoff analysis.\",\"PeriodicalId\":245879,\"journal\":{\"name\":\"Proceedings 1998 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (Cat. No.98EX223)\",\"volume\":\"349 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-11-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1998 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (Cat. No.98EX223)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DFTVS.1998.732148\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1998 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (Cat. No.98EX223)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DFTVS.1998.732148","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

传统上,芯片的平面设计是为了最小化芯片总面积和降低布线成本而确定的。最近有研究表明,平面设计也会影响芯片的成品率。因此,在选择平面图时,除了考虑布线成本外,还需要考虑预期产量。本文的目标是研究两个看似不相关的目标,即提高产量和最小化路径复杂性,并找出它们是否会导致不同的最优布局,从而需要进行权衡分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Yield and routing objectives in floorplanning
Traditionally the floorplan of a chip has been determined so as to minimize the total chip area and reduce the routing costs. Recently, it has been shown that the floorplan also affects the yield of the chip. Consequently, it becomes desirable to consider the expected yield, in addition to the cost of routing, when selecting a floorplan. The goal of this paper is to study the two seemingly disjoint objectives of yield enhancement and routing complexity minimization, and find out whether they lead to different optimal floorplans, resulting in a need for a tradeoff analysis.
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