“玻璃包”-光电电路板(EOCB)和传感器模块使用薄玻璃箔的光子封装

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI:10.1109/ESTC.2008.4684532

H. Schroder, Norbert Arndt-Staufenbiel, L. Brusberg

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引用次数: 9

摘要

ldqulasspackrdquo概念将作为一种新的封装技术平台，用于广泛的光电应用领域，如光学背板、电光电路板(EOCB)和传感器。使用几十微米厚度的薄玻璃箔作为衬底和互连材料是该概念的关键点。将介绍第一次实现。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules

The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.

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来源期刊

2008 2nd Electronics System-Integration Technology Conference

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