一种新型低成本夹芯电源封装结构及其制造

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Pub Date : 2019-12-01 DOI:10.1109/EPTC47984.2019.9026671

Garry Ge, G. Lye, Sonder Wang, J. Zaal

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引用次数: 0

摘要

目前，叠片3D封装非常流行，尤其是这种功率3D封装。例如，有时在功率模上设计控制模堆叠;(参考下文封装结构设计)和控制模具采用更薄的铜丝粘接;但电源模具采用较厚的铝丝粘合。这看起来像传统的堆叠模具设计。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A New Type Low Cost Sandwiched Power Package Structure and its Manufacturing

Now stacked die 3D package is much popular, especially for such power 3D package. For example, sometimes it designs control die stacking on power die; (refer to below package structure design) and control die apply thinner Cu wire bonding; but power die applies thicker Al wire bonding. This looks like conventional stacked dies design.

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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

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