低温聚酰亚胺-聚酰亚胺直接键合

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 1900-01-01 DOI:10.23919/LTB-3D.2019.8735216

Hong-Che Liu, Chih Chen

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引用次数: 2

摘要

在本研究中，两个聚酰亚胺(PI)薄膜在250/300°C下键合60分钟，观察到良好的键合界面，几乎没有空洞。在键合过程中，部分固化的PI膜仍发生交联反应，导致键合样品中出现空洞。

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Low temperature polyimide-to-polyimide direct bonding

In this study, two polyimide (PI) films were bonded at 250/300 °C for 60 min. A good bonding interface with few voids was observed. During the bonding process, the partial cured PI film still underwent cross-linking reaction, resulting the voids in bonding sample..

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来源期刊

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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