MEMS封装的密封性测试与失效分析

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI:10.1109/IPFA.2007.4378075

D. Wolf, A. Jourdain, P. de Moor, H. Tilmans, L. Marchand

{"title":"MEMS封装的密封性测试与失效分析","authors":"D. Wolf, A. Jourdain, P. de Moor, H. Tilmans, L. Marchand","doi":"10.1109/IPFA.2007.4378075","DOIUrl":null,"url":null,"abstract":"Several microsystem applications require hermetic or semi- hermetic packages. It is for this reason mandatory to be able to check the hermeticity of these packages. The standard tests, using gross leak and fine leak, work very well for large cavities, but might give erroneous results for small cavities as typically used for MEMS. We discussed different alternative test methods.","PeriodicalId":334987,"journal":{"name":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"Hermeticity Testing and Failure Analysis of MEMS Packages\",\"authors\":\"D. Wolf, A. Jourdain, P. de Moor, H. Tilmans, L. Marchand\",\"doi\":\"10.1109/IPFA.2007.4378075\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Several microsystem applications require hermetic or semi- hermetic packages. It is for this reason mandatory to be able to check the hermeticity of these packages. The standard tests, using gross leak and fine leak, work very well for large cavities, but might give erroneous results for small cavities as typically used for MEMS. We discussed different alternative test methods.\",\"PeriodicalId\":334987,\"journal\":{\"name\":\"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-07-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2007.4378075\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2007.4378075","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 20

摘要

一些微系统应用需要密封或半密封的封装。因此，必须能够检查这些包装的密封性。使用粗泄漏和细泄漏的标准测试对于大空腔非常有效，但对于通常用于MEMS的小空腔可能会给出错误的结果。我们讨论了不同的替代测试方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Hermeticity Testing and Failure Analysis of MEMS Packages

Several microsystem applications require hermetic or semi- hermetic packages. It is for this reason mandatory to be able to check the hermeticity of these packages. The standard tests, using gross leak and fine leak, work very well for large cavities, but might give erroneous results for small cavities as typically used for MEMS. We discussed different alternative test methods.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits

自引率

0.00%

发文量