{"title":"采用有限元法建立了mil - hdbk - 217 SMT模型","authors":"G. A. Bivens, E.F. Pello","doi":"10.1109/RELPHY.1992.187640","DOIUrl":null,"url":null,"abstract":"A MIL-HDBK-217, Military Handbook for Reliability Prediction of Electronic Equipment, reliability prediction model was developed for surface mount technology (SMT) using thermal finite element analysis (FEA) simulations and environmental test data. FEAs for a number of conditions and packages were performed, the resulting strain values were translated to number of cycles to failure, and data regression distribution techniques were used to generate a failure rate model. This methodology, which is based on established analytical techniques and procedures, provides an alternative procedure for developing failure rate models when traditional approaches are not applicable.<<ETX>>","PeriodicalId":154383,"journal":{"name":"30th Annual Proceedings Reliability Physics 1992","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Using FEA to develop a MIL-HDBK-2 17 SMT model\",\"authors\":\"G. A. Bivens, E.F. Pello\",\"doi\":\"10.1109/RELPHY.1992.187640\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A MIL-HDBK-217, Military Handbook for Reliability Prediction of Electronic Equipment, reliability prediction model was developed for surface mount technology (SMT) using thermal finite element analysis (FEA) simulations and environmental test data. FEAs for a number of conditions and packages were performed, the resulting strain values were translated to number of cycles to failure, and data regression distribution techniques were used to generate a failure rate model. This methodology, which is based on established analytical techniques and procedures, provides an alternative procedure for developing failure rate models when traditional approaches are not applicable.<<ETX>>\",\"PeriodicalId\":154383,\"journal\":{\"name\":\"30th Annual Proceedings Reliability Physics 1992\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"30th Annual Proceedings Reliability Physics 1992\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1992.187640\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"30th Annual Proceedings Reliability Physics 1992","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1992.187640","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A MIL-HDBK-217, Military Handbook for Reliability Prediction of Electronic Equipment, reliability prediction model was developed for surface mount technology (SMT) using thermal finite element analysis (FEA) simulations and environmental test data. FEAs for a number of conditions and packages were performed, the resulting strain values were translated to number of cycles to failure, and data regression distribution techniques were used to generate a failure rate model. This methodology, which is based on established analytical techniques and procedures, provides an alternative procedure for developing failure rate models when traditional approaches are not applicable.<>
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