小于0.1 /spl mu/m的PD/SOI CMOS电路的设计考虑

C. Chuang, R. Joshi, R. Puri, Keunwoo Kim
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引用次数: 2

摘要

本文综述了用于高性能数字应用的低于0.1 /spl mu/m的部分耗尽SOI (PD/SOI) CMOS电路的电路设计考虑。强调了技术/设备扩展和设计挑战的影响。本文讨论了PD/SOI器件结构的特殊设计问题,如寄生双极效应和减小的V/亚T/泄漏、滞后的V/亚T/变化、低压冲击电离、更高的V/亚T、保持足够的V/亚T的lin/、sat/、Si膜的缩放/变薄、栅到体隧道电流、自热、软错误率(SER)以及SOI上应变Si通道的引入。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design considerations of scaled sub-0.1 /spl mu/m PD/SOI CMOS circuits
This paper reviews the circuit design considerations of scaled sub-0.1 /spl mu/m partially-depleted SOI (PD/SOI) CMOS circuits for high-performance digital applications. The impact of technology/device scaling and design challenges are highlighted. Unique design aspects and issues resulting from the scaling of PD/SOI device structure, such as parasitic bipolar effect and reduced-V/sub T/ leakage, hysteretic V/sub T/ variation, low-voltage impact ionization, higher V/sub T,lin/ to maintain adequate V/sub T,sat/, scaling/thinning of Si film, gate-to-body tunneling current, self-heating, soft error rate (SER), and the introduction of strained-Si channel on SOI are addressed.
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