先进的Cu/Low-k BEOL集成，可靠性和可扩展性

2007 IEEE International Interconnect Technology Conferencee Pub Date : 2007-06-04 DOI:10.1109/IITC.2007.382347

D. Edelstein

{"title":"先进的Cu/Low-k BEOL集成，可靠性和可扩展性","authors":"D. Edelstein","doi":"10.1109/IITC.2007.382347","DOIUrl":null,"url":null,"abstract":"This talk will be a detailed discussion of technical aspects of Cu BEOL wiring that may be helpful or essential to preserve it successful migration path. The focus will be on BEOL architecture, integration techniques, their impact on reliability, and their outlooks for 32 nm. The talk will mainly call on new data produced by our Research and Development organizations and their associated alliances.","PeriodicalId":403602,"journal":{"name":"2007 IEEE International Interconnect Technology Conferencee","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Advanced Cu/Low-k BEOL Integration, Reliability, and Extendibility\",\"authors\":\"D. Edelstein\",\"doi\":\"10.1109/IITC.2007.382347\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This talk will be a detailed discussion of technical aspects of Cu BEOL wiring that may be helpful or essential to preserve it successful migration path. The focus will be on BEOL architecture, integration techniques, their impact on reliability, and their outlooks for 32 nm. The talk will mainly call on new data produced by our Research and Development organizations and their associated alliances.\",\"PeriodicalId\":403602,\"journal\":{\"name\":\"2007 IEEE International Interconnect Technology Conferencee\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-06-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE International Interconnect Technology Conferencee\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2007.382347\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Interconnect Technology Conferencee","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2007.382347","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本次演讲将详细讨论Cu BEOL布线的技术方面，这些技术方面可能对保持其成功迁移路径有帮助或必不可少。重点将是BEOL架构、集成技术、它们对可靠性的影响，以及它们在32nm工艺中的前景。讲座将主要介绍我们的研究和发展组织及其相关联盟产生的新数据。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Advanced Cu/Low-k BEOL Integration, Reliability, and Extendibility

This talk will be a detailed discussion of technical aspects of Cu BEOL wiring that may be helpful or essential to preserve it successful migration path. The focus will be on BEOL architecture, integration techniques, their impact on reliability, and their outlooks for 32 nm. The talk will mainly call on new data produced by our Research and Development organizations and their associated alliances.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2007 IEEE International Interconnect Technology Conferencee

自引率

0.00%

发文量