无铅芯片级封装板级跌落响应的瞬态分析及实验验证

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396697

Chang-Lin Yeh, Y. Lai

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引用次数: 31

摘要

通过支撑激励方案，采用隐式三维有限元法分析了受JEDEC跌落试验影响的板级芯片级封装的瞬态结构响应。通过实验验证了所分析的无铅焊点的失效模式。此外，还研究了落点方向对试验车辆可靠性的影响。

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Transient analysis of board-level drop response of lead-free chip-scale packages with experimental verifications

Through the support excitation scheme, transient structural responses of a board-level chip-scale package subjected to the JEDEC drop test are analyzed using the implicit three-dimensional finite element analysis. Analyzed failure modes of the lead-free solder joints are verified with experimental observations. The effect of drop orientations on the reliability of the test vehicle is also examined.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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